8. Qian Ye, Nian Cai*, Jiaming Li, Feiyang Li, Han Wang, Xindu Chen. IC solder joint inspection based on an adaptive-template method. IEEE Transactions on Components, Packaging and Manufacturing Technology, June 2018, 8 (6): 1121-1127
- Translation or Not:no
Pre One:7. Qian Ye, Nian Cai*, Hao Xia, Guandong Cen, Xindu Chen, Han Wang. An effective optimization scheme for ECG signal denoising via low-rank matrix decomposition. Circuits, Systems and Signal Processing, Jan. 2019, 38 (1): 138-152
Next One:9. Nian Cai*, Guandong Cen, Jixiu Wu, Feiyang Li, Han Wang, Xindu Chen. SMT solder joint inspection via a novel cascaded convolutional neural network. IEEE Transactions on Components, Packaging and Manufacturing Technology, Apr. 2018, 8 (4): 670-677,