9. Nian Cai*, Guandong Cen, Jixiu Wu, Feiyang Li, Han Wang, Xindu Chen. SMT solder joint inspection via a novel cascaded convolutional neural network. IEEE Transactions on Components, Packaging and Manufacturing Technology, Apr. 2018, 8 (4): 670-677,
- Translation or Not:no
Pre One:8. Qian Ye, Nian Cai*, Jiaming Li, Feiyang Li, Han Wang, Xindu Chen. IC solder joint inspection based on an adaptive-template method. IEEE Transactions on Components, Packaging and Manufacturing Technology, June 2018, 8 (6): 1121-1127
Next One:10. Fu Zhang, Nian Cai*, Jixiu Wu, Guandong Cen, Han Wang, Xindu Chen. Image denoising method based on a deep convolution neural network. IET Image Processing, Apr. 2018, 12 (4): 485-493.